Used for etching materials of the semiconductor industry (silicon and quartz wafers)
HF is used in integrated circuit technology for the local oxidation of the channel-limiting region.
Product Characteristics:
№ |
Name of indicator |
Raw material |
Test results |
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ТУ 2612-028-6988698-2014 | Sample No. 1 | Sample No. 2 | |||||
1 |
Mass fraction of hydrofluoric acid (HF),% |
46-49 |
49 |
49 |
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Mass fraction of impurities, not more than: |
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% |
ppm | % | ppm | % |
ppm |
||
2 |
Al |
3 · 10-6 |
0,03 | 7 · 10-8 | 0,0007 | 2 · 10-8 |
0,0002 |
3 |
Ba |
2 · 10-6 |
0,02 | 1 · 10-8 | 0,0001 | 0 |
0,0000 |
4 |
B |
3 · 10-7 |
0,003 | 0 | 0,0000 | 0 |
0,0000 |
5 |
Bi |
2 · 10-6 |
0,02 | 0 | 0,0000 | 0 |
0,0000 |
6 |
Fe |
2 · 10-6 |
0,02 | 1,5 · 10-7 | 0,0015 | 0 |
0,0000 |
7 |
Au |
1 · 10-7 |
0,001 | — | — | — |
— |
8 |
K |
1 · 10-5 |
0,1 | 1,9 · 10-7 | 0,0019 | 1,3 · 10-7 |
0,0013 |
9 |
Ca |
5 · 10-6 |
0,05 | 8,9 · 10-7 | 0,0089 | 1,21 · 10-6 |
0,0121 |
10 |
Co |
5 · 10-7 |
0,005 | 1 · 10-8 | 0,0001 | 1 · 10-8 | 0,0001 |
11 |
Si |
1 · 10-3 |
10 | 1 · 10-7 | 0,0010 | 6 · 10-8 |
0,0006 |
12 |
Mg |
1 · 10-6 |
0,01 | 1,7 · 10-7 | 0,0017 | 1,8 · 10-7 |
0,0018 |
13 |
Mn |
1 · 10-6 |
0,01 | 0 | 0,0000 | 0 |
0,0000 |
14 |
Cu |
2 · 10-7 |
0,002 | 0 | 0,0000 | 1 · 10-8 |
0,0001 |
15 |
As |
5 · 10-6 |
0,05 | 8 · 10-8 | 0,0008 | 0 |
0,0000 |
16 |
Na |
1 · 10-5 |
0,1 | 1 · 10-7 | 0,0010 | 9 · 10-8 |
0,0009 |
17 |
Ni |
3 · 10-7 |
0,003 | 3 · 10-8 | 0,0003 | 0 |
0,0000 |
18 |
Pb |
5 · 10-7 |
0,005 | 0 | 0,0000 | 6 · 10-8 |
0,0006 |
19 |
Ag |
1 · 10-7 |
0,001 | 1 · 10-8 | 0,0001 | 0 |
0,0000 |
20 |
Sb |
5 · 10-7 |
0,005 | 0 | 0,0000 | 0 |
0,0000 |
21 |
Ti |
5 · 10-7 |
0,005 |
6 · 10-8 | 0,0006 | 2 · 10-8 |
0,0002 |
22 |
P |
3 · 10-6 |
0,03 | 0 | 0,0000 | 0 |
0,0000 |
23 |
Cr |
3 · 10-7 |
0,003 | 0 | 0,0000 | 0 |
0,0000 |
24 |
Zn |
1 · 10-6 |
0,01 | 7 · 10-8 | 0,0007 | 1,3 · 10-7 |
0,0013 |
25 |
S |
1 · 10-4 | 1,0 | 0 | 0,0000 | 0 |
0,0000 |
Purity of the main product (HF) : |
99,998 % | 99,999998 % |
99,999998 % |
BRC Spectr offers a set of equipment for the purification of the initial HF acid to values of 99.999998%
Is actual for machines for growing crystals with mass more 60 kg The main upgrade is to use a new type of heater.
Used for etching materials of the semiconductor industry (silicon and quartz wafers)
The machine is designed for obtaining high-purity fractions of silicon dioxide SiO2 purity up to 99,9995 %. High-purity quartz is used for the production of materials and products for